Stinville Research Group

Materials Science and Engineering


High-Resolution Digital Image Correlation (SEM-DIC/HR-DIC)

The combination of scanning electron microscopy (SEM) and digital image correlation (DIC) has recently emerged as a robust method for experimental quantification of 2-D in-plane strain fields at the microstructure scale. However, it is challenging to obtain the necessary spatial resolution to measure the strain field at the micron and submicron scales, especially when plasticity (slip) is involved. In several studies, grain-scale spatial resolution has been achieved in materials with mm- or cm-scale grains. However, since many high strength structural materials have grain sizes of 100 μm or smaller, it is necessary to refine the DIC measurements to finer scales.


Surface Patterning for High Resolution Digital Image Correlation under scanning electron microcope.


J.C. Stinville, M.P. Echlin, D. Texier, F. Bridier, P. Bocher, T.M. Pollock, Sub-Grain Scale Digital Image Correlation by Electron Microscopy for Polycrystalline Materials during Elastic and Plastic Deformation. Experimental Mechanics, 2015.

M.A. Charpagne, J. Hestroffer, A. T. Polonsky, M.P. Echlin, D. Texier, V. Valle, I. J. Beyerlein, T. M.Pollock, J.C. Stinville. Slip localization in Inconel 718: a three-dimensional and statistical perspective. Acta Materialia, 2021.

J.C. Stinville, T. Francis, A.T.Polonsky, C.J Torbet, M.A. Charpagne, Z. Chen, F. Bourdin, V. Valle, P.G. Callahan, M.P. Echlin, T.M. Pollock. Time-Resolved Digitial Image Correlation in the Scanning Electron Microscope for Analysis of Time-Dependent Mechanisms. Experimental Mechanics, 2020.

J.C. Stinville, M.A. Charpagne, F. Bourdin, P.G. Callahan, Z. Chen, M.P. Echlin, D. Texier, J. Cormier, P. Villechaise, T.M. Pollock, V. Valle. Measurement of Elastic and Rotation Fields during Irreversible Deformation using Heaviside-Digital Image Correlation. Materials Characterization, Material Characterization, 2020.

J.C. Stinville, P.G. Callahan, M.A. Charpagne, M.P. Echlin, V. Valle, T.M. Pollock. Direct Measurements of Slip Irreversibility in a Nickel-Based Superalloy using High Resolution Digital Image Correlation. Acta Materialia, 2020.

W.C. Lenthe, J.C. Stinville, M.P. Echlin, Z. Chen, S. Daly, T.M. Pollock. Advanced Detector Signal Acquisition and Electron Beam Scanning for High Resolution SEM Imaging. Ultramicroscopy, 2018.

J.C. Stinville, M.P. Echlin, P. Callahan, D. Texier, F. Bridier, P. Bocher, T.M. Pollock. Measurement of strain localization resulting from monotonic and cyclic loading at 650°C in nickel base superalloys, Experimental Mechanics, 2017.

J.C Stinville, N. Vanderesse, F. Bridier, P. Bocher, T.M. Pollock, High resolution mapping of strain localization near twin boundaries in a nickel-base superalloy. Acta Materellia, 2015.

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