Slip localization in Inconel 718: A three-dimensional and statistical perspective. M.A. Charpagne, J. Hestroffer, A. T. Polonsky, M.P. Echlin, D. Texier, V. Valle, I. J. Beyerlein, T. M.Pollock, J.C. Stinville. Acta Materialia, 215 (2021).
The slip localization behavior of the polycrystalline nickel base superalloy Inconel 718 during monotonic tensile loading at room temperature, is investigated for the first time in relation to the 3D microstructure. Multi-modal data merging tools are used to recombine high resolution digital image correlation (HR-DIC) data with 3D electron back-scatter diffraction tomography (3D EBSD), over a wide region of interest. This procedure enables reconstruction of the slip band planes in the 3D microstructure. Statistical analyses conducted over 500 individual slip bands reveal strong correlations between their location and specific microstructure configurations. In particular, over half of the slip bands emanate from triple junction lines (3D lines defined by the junction of three crystals). Moreover, the most intense and longest slip bands, which would become critical fatigue crack nucleation sites during cyclic loading, are located close and parallel to particular annealing twin boundaries and are simultaneously connected to triple junction lines. Crystal plasticity finite elements calculations are performed on the experimental microstructure to identify the slip activity that results in the formation of high intensity slip bands (localized plasticity) or zones of high lattice rotation (non-localized plasticity) in these particular microstructure regions.