UNIVERSITY OF

ILLINOIS

URBANA-CHAMPAIGN

Stinville Research Group

Materials Science and Engineering

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Science Article: Deformation fingerprints

Engineers can now capture and predict the strength of metallic materials subjected to cycling loading, or fatigue strength, in a matter of hours – not the months or years it takes using current methods.

In a new study, researchers from the University of Illinois Urbana-Champaign report that automated high-resolution electron imaging can capture the nanoscale deformation events that lead to metal failure and breakage at the origin of metal failure. The new method helps scientists to rapidly predict the fatigue strength of any alloy, and design new materials for engineering systems subject to repeated loading for medical, transportation, safety, energy and environmental applications.

The findings of the study, led by materials science and engineering professors Jean-Charles Stinville and Marie Charpagne, are published in the journal Science.

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